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1.
ACS Appl Mater Interfaces ; 16(21): 27952-27960, 2024 May 29.
Artigo em Inglês | MEDLINE | ID: mdl-38808703

RESUMO

Capable of directly capturing various physiological signals from human skin, skin-interfaced bioelectronics has emerged as a promising option for human health monitoring. However, the accuracy and reliability of the measured signals can be greatly affected by body movements or skin deformations (e.g., stretching, wrinkling, and compression). This study presents an ultraconformal, motion artifact-free, and multifunctional skin bioelectronic sensing platform fabricated by a simple and user-friendly laser patterning approach for sensing high-quality human physiological data. The highly conductive membrane based on the room-temperature coalesced Ag/Cu@Cu core-shell nanoparticles in a mixed solution of polymers can partially dissolve and locally deform in the presence of water to form conformal contact with the skin. The resulting sensors to capture improved electrophysiological signals upon various skin deformations and other biophysical signals provide an effective means to monitor health conditions and create human-machine interfaces. The highly conductive and stretchable membrane can also be used as interconnects to connect commercial off-the-shelf chips to allow extended functionalities, and the proof-of-concept demonstration is highlighted in an integrated pulse oximeter. The easy-to-remove feature of the resulting device with water further allows the device to be applied on delicate skin, such as the infant and elderly.


Assuntos
Dispositivos Eletrônicos Vestíveis , Humanos , Pele/química , Monitorização Fisiológica/instrumentação , Monitorização Fisiológica/métodos , Prata/química , Cobre/química , Técnicas Biossensoriais/instrumentação , Técnicas Biossensoriais/métodos , Artefatos , Nanopartículas Metálicas/química , Movimento (Física) , Condutividade Elétrica
2.
ACS Appl Mater Interfaces ; 12(40): 45504-45515, 2020 Oct 07.
Artigo em Inglês | MEDLINE | ID: mdl-32911929

RESUMO

A soft body area sensor network presents a promising direction in wearable devices to integrate on-body sensors for physiological signal monitoring and flexible printed circuit boards (FPCBs) for signal conditioning/readout and wireless transmission. However, its realization currently relies on various sophisticated fabrication approaches such as lithography or direct printing on a carrier substrate before attaching to the body. Here, we report a universal fabrication scheme to enable printing and room-temperature sintering of the metal nanoparticle on paper/fabric for FPCBs and directly on the human skin for on-body sensors with a novel sintering aid layer. Consisting of polyvinyl alcohol (PVA) paste and nanoadditives in the water, the sintering aid layer reduces the sintering temperature. Together with the significantly decreased surface roughness, it allows for the integration of a submicron-thick conductive pattern with enhanced electromechanical performance. Various on-body sensors integrated with an FPCB to detect health conditions illustrate a system-level example.


Assuntos
Monitorização Fisiológica , Pele/química , Temperatura , Dispositivos Eletrônicos Vestíveis , Humanos , Nanopartículas Metálicas/química , Níquel/química , Papel , Tamanho da Partícula , Prata/química , Propriedades de Superfície
3.
Nanotechnology ; 30(50): 505303, 2019 Dec 13.
Artigo em Inglês | MEDLINE | ID: mdl-31509803

RESUMO

Ultralow-temperature sintering plays a vital role in the development of flexible printed electronics, which improves flexibility and reduces energy consumption. This study investigates the ultralow-temperature sintering of large-sized silver nanoparticles (Ag NPs) by laser modification of the substrate surface. Ag NPs in conductive ink were sintered at only 60 °C. Designing the appropriate size of modified regions, the sintered Ag layer exhibits a sheet resistance of only 0.274 Ω and withstands 10 000 folding cycles. Energy-dispersive x-ray spectroscopy showed that TiO2 formed by laser ablation promotes the sintering of Ag NPs and joining with the substrate. A paper-based flexible integrated circuit board was also prepared.

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