In Situ Observation of Field-Induced Nanoprotrusion Growth on a Carbon-Coated Tungsten Nanotip.

Nanoprotrusion (NP) on metal surface and its inevitable contamination layer under high electric field is often considered as the primary precursor that leads to vacuum breakdown, which plays an extremely detrimental effect for high energy physics equipment and many other devices. Yet, the NP growth has never been experimentally observed. Here, we conduct field emission (FE) measurements along with in situ transmission electron microscopy (TEM) imaging of an amorphous-carbon (a-C) coated tungsten nanotip at various nanoscale vacuum gap distances. We find that under certain conditions, the FE current-voltage (I-V) curves switch abruptly into an enhanced-current state, implying the growth of an NP. We then run field emission simulations, demonstrating that the temporary enhanced-current I-V is perfectly consistent with the hypothesis that a NP has grown at the apex of the tip. This hypothesis is also confirmed by the repeatable in situ observation of such a nanoprotrusion and its continued growth during successive FE measurements in TEM. We tentatively attribute this phenomenon to field-induced biased diffusion of surface a-C atoms, after performing a finite element analysis that excludes the alternative possibility of field-induced plastic deformation.

Heat-induced morphological changes in silver nanowires deposited on a patterned silicon substrate.

Metallic nanowires (NWs) are sensitive to heat treatment and can split into shorter fragments within minutes at temperatures far below the melting point. This process can hinder the functioning of NW-based devices that are subject to relatively mild temperatures. Commonly, heat-induced fragmentation of NWs is attributed to the interplay between heat-enhanced diffusion and Rayleigh instability. In this work, we demonstrated that contact with the substrate plays an important role in the fragmentation process and can strongly affect the outcome of the heat treatment. We deposited silver NWs onto specially patterned silicon wafers so that some NWs were partially suspended over the holes in the substrate. Then, we performed a series of heat-treatment experiments and found that adhered and suspended parts of NWs behave differently under the heat treatment. Moreover, depending on the heat-treatment process, fragmentation in either adhered or suspended parts can dominate. Experiments were supported by finite element method and molecular dynamics simulations.

Nano1D: An accurate computer vision software for analysis and segmentation of low-dimensional nanostructures.

Nanoparticles in microscopy images are usually analyzed qualitatively or manually and there is a need for autonomous quantitative analysis of these objects. In this paper, we present a physics-based computational model for accurate segmentation and geometrical analysis of one-dimensional deformable overlapping objects from microscopy images. This model, named Nano1D, has four steps of preprocessing, segmentation, separating overlapped objects and geometrical measurements. The model is tested on SEM images of Ag and Au nanowire taken from different microscopes, and thermally fragmented Ag nanowires transformed into nanoparticles with different lengths, diameters, and population densities. It successfully segments and analyzes their geometrical characteristics including lengths and average diameter. The function of the algorithm is not undermined by the size, number, density, orientation and overlapping of objects in images. The main strength of the model is shown to be its ability to segment and analyze overlapping objects successfully with more than 99 % accuracy, while current machine learning and computational models suffer from inaccuracy and inability to segment overlapping objects. Benefiting from a graphical user interface, Nano1D can analyze 1D nanoparticles including nanowires, nanotubes, nanorods in addition to other 1D features of microstructures like microcracks, dislocations etc.

Reshaping Covalent Nanowires by Exploiting an Unexpected Plasticity Mediated by Deformation Twinning.

Nanowires (NWs) are among the most studied nanostructures as they have numerous promising applications thanks to their various unique properties. Furthermore, the properties of NWs can be tailored during synthesis by introducing structural defects such as nano-twins, periodic polytypes, and kinks, i.e., abrupt changes in their axial direction. Here, this work reports for the first time the postsynthesis formation of such defects, achieved by exploiting a peculiar plasticity that may occur in nanosized covalent materials. Specifically, in this work the authors found that single-crystal CuO NWs can form double kinks when subjected to external mechanical loading. Both the microscopy and atomistic modeling suggest that deformation-induced twinning along the ( 1 ¯ 10 ) $( {\bar{1}10} )$ plane is the mechanism behind this effect. In a single case the authors are able to unkink a NW back to its initial straight profile, indicating the possibility of reversible plasticity in CuO NWs, which is supported by the atomistic simulations. The phenomenon reported here provides novel insights into the mechanisms of plastic deformation in covalent NWs and offers potential avenues for developing techniques to customize the shape of NWs postsynthesis and introduce new functionalities.

Dip-coating electromechanically active polymer actuators with SIBS from midblock-selective solvents to achieve full encapsulation for biomedical applications.

Soft and compliant ionic electromechanically active polymer actuators (IEAPs) are a promising class of smart materials for biomedical and soft robotics applications. These materials change their shape in response to external stimuli like the electrical signal. This shape-change results solely from the ion flux inside the composite and hence the material can be miniaturized below the centimeter and millimeter levels-something that still poses a challenge for many other conventional actuation mechanisms in soft robotics (e.g., pneumatic, hydraulic, or tendon-based systems). However, the components used to prepare IEAPs are typically not safe for the biological environment, nor is the environment safe for the actuator. Safety concerns and unreliable operation in foreign liquid environments have been some of the main obstacles for the widespread adoption of IEAPs in many areas, e.g., in biomedical applications. Here we show a novel approach to fully encapsulate IEAP actuators with the biocompatible block copolymer SIBS (poly(styrene-block-isobutylene-block-styrene)) dissolved in block-selective solvents. Reduction in the bending amplitude due to the added passive layers, a common negative side-effect of encapsulating IEAPs, was not observed in this work. In conclusion, the encapsulated actuator is steered through a tortuous vasculature mock-up filled with a viscous buffer solution mimicking biological fluids.

Thermal, Mechanical, and Acoustic Properties of Polydimethylsiloxane Filled with Hollow Glass Microspheres.

Polydimethylsiloxane (PDMS) is the most widely used silicon-based polymer due to its versatility and its various attractive properties. The fabrication of PDMS involves liquid phase cross-linking to obtain hydrophobic and mechanically flexible material in the final solid form. This allows to add various fillers to affect the properties of the resulting material. PDMS has a relatively low Thermal Conductivity (TC), in the order of 0.2 W/mK, which makes it attractive for thermal insulation applications such as sealing in construction. Although a further decrease in the TC of PDMS can be highly beneficial for such applications, most research on the thermal properties of PDMS composites have focused on fillers that increase the TC rather than decrease it. In the present work, we propose a simple and reliable method for making a PDMS-based composite material with significantly improved thermal insulation properties, by adding hollow glass microspheres (HGMs) to the mixture of the liquid base and the cross-linker (10:1 ratio), followed by degassing and heat-assisted crosslinking. We obtained a 31% reduction of thermal conductivity and a 60% increase in the elastic modulus of samples with HGM content of 17% by weight. At the same time, the sound insulation capacity of the PDMS-HGM composite is slightly decreased in comparison to pure PDMS, as a result of its lower density. Finally, the wettability of the samples had no dependence on HGM content.

Mechanism of Spontaneous Surface Modifications on Polycrystalline Cu Due to Electric Fields.

We present a credible mechanism of spontaneous field emitter formation in high electric field applications, such as Compact Linear Collider in CERN (The European Organization for Nuclear Research). Discovery of such phenomena opens new pathway to tame the highly destructive and performance limiting vacuum breakdown phenomena. Vacuum breakdowns in particle accelerators and other devices operating at high electric fields is a common problem in the operation of these devices. It has been proposed that the onset of vacuum breakdowns is associated with appearance of surface protrusions while the device is in operation under high electric field. Moreover, the breakdown tolerance of an electrode material was correlated with the type of lattice structure of the material. Although biased diffusion under field has been shown to cause growth of significantly field-enhancing tips starting from initial nm-size protrusions, the mechanisms and the dynamics of the growth of the latter have not been studied yet. In the current paper we conduct molecular dynamics simulations of nanocrystalline copper surfaces and show the possibility of protrusion growth under the stress exerted on the surface by an applied electrostatic field. We show the importance of grain boundaries on the protrusion formation and establish a linear relationship between the necessary electrostatic stress for protrusion formation and the temperature of the system. Finally, we show that the time for protrusion formation decreases with the applied electrostatic stress, we give the Arrhenius extrapolation to the case of lower fields, and we present a general discussion of the protrusion formation mechanisms in the case of polycrystalline copper surfaces.