Electro-galvanic alkalization and treatment of rainwater to obtain drinking water.

Rainwater Electro-Galvanic Alkalization (EGA) was performed using copper and magnesium (1:1) electrode. Efficiently removal of pollutants without external energy consumption was carried out, in addition essential ions were dosed for alkalization of rainwater. The optimal system conditions were obtained using response surface methodology (RSM) by considering the following operating variables: flow rate and concentration of the supporting electrolyte (NaCl and CaCl2). Furthermore, the maximum efficiency of nitrate, ammoniacal nitrogen, colour, and turbidity removal was evaluated. The results showed that the response variables were mainly sensitive to the type of supporting electrolyte used and the flow rate. Under experimental conditions of 0.009 M (NaCl) and 20 mL min-1, the removal rate was 74.19%, 72.49%, and 81.43% for nitrates, colour, and turbidity, respectively, and the lowest concentration of ammoniacal nitrogen (0.99mgL-1) was obtained. The kinetic models for nitrate and colour were fitted to zero-order models with k=0.33mgL-1min-1 and k=0.933Pt-Co, respectively. In addition, turbidity was fitted to a first-order model (k=0.1661min-1), and ammoniacal nitrogen was fitted to a second-order model (k=0.0217Lmg-1min-1). The concentration increases of minerals such as Ca and Mg, which rises the rainwater alkalinity after treatment (pH shift from 6.1 to 8.91), was determined by inductively coupled plasma (ICP) analysis.

Acid mine drainage (AMD) treatment using galvanic electrochemical system Al-Cu.

Acid mine drainage was evaluated using a galvanic (GV) electrochemical system, Al-Cu (anode/cathode), based on a 32 factorial design. The factors analyzed were anodic area/volume ratios (A/V) of 0.037, 0.072, and 0.112 cm2/cm3, and treatment time from 0.25-8 h, and analyses were performed in duplicate with 11 degrees of freedom. The response variables were the total dissolved solids and concentrations of As, Cu, Co, Cr, Pb, Fe, Ni, and SO42-. The pH, electrical conductivity, and temperature were monitored during the process. Significant differences between treatments were determined by analysis of variance with Tukey's test (p < 0.05) using Statgraphics Centurion XVI.I software. The results showed that a greater electrode surface, A/V ratio, and treatment time improved pollutant removal. The spontaneous reactions generated by the galvanic cell, through the current that flows owing to the potential difference between the Al and Cu electrodes, allows the removal of heavy metals, arsenic, and SO42- by coagulation and precipitation mechanisms. The removal efficiencies achieved were Cu (99.1%), As (76.6%), Ni (80.2%), Pb (83.6%), Cr (100%), Fe (93.71%), and 92.9% for sulfates. The X-ray diffraction and Raman analyses of the solid fraction indicated that cuprite was formed with a purity of 96%, and the recovery of Cu by the GV system may be a viable option for mining companies.

A Flash-Induced Robust Cu Electrode on Glass Substrates and Its Application for Thin-Film µLEDs.

A robust Cu conductor on a glass substrate for thin-film µLEDs using the flash-induced chemical/physical interlocking between Cu and glass is reported. During millisecond light irradiation, CuO nanoparticles (NPs) on the display substrate are transformed into a conductive Cu film by reduction and sintering. At the same time, intensive heating at the boundary of CuO NPs and glass chemically induces the formation of an ultrathin Cu2 O interlayer within the Cu/glass interface for strong adhesion. Cu nanointerlocking occurs by transient glass softening and interface fluctuation to increase the contact area. Owing to these flash-induced interfacial interactions, the flash-activated Cu electrode exhibits an adhesion energy of 10 J m-2 , which is five times higher than that of vacuum-deposited Cu. An AlGaInP thin-film vertical µLED (VLED) forms an electrical interconnection with the flash-induced Cu electrode via an ACF bonding process, resulting in a high optical power density of 41 mW mm-2 . The Cu conductor enables reliable VLED operation regardless of harsh thermal stress and moisture infiltration under a high-temperature storage test, temperature humidity test, and thermal shock test. 50 × 50 VLED arrays transferred onto the flash-induced robust Cu electrode show high illumination yield and uniform distribution of forward voltage, peak wavelength, and device temperature.

Individually position-addressable metal-nanofiber electrodes for large-area electronics.

A individually position-addressable large-scale-aligned Cu nanofiber (NF) array is fabricated using electro-hydrodynamic nanowire printing. The printed single-stranded Cu NF has a diameter of about 710 nm and resistivity of 14.1 µΩ cm and is effectively used as source/drain nanoelectrode in pentacene transistors, which show a 25-fold increased hole mobility than that of a device with Cu thin-film electrodes.