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STM patterned nanowire measurements using photolithographically defined implants in Si(100).
Ramanayaka, A N; Kim, Hyun-Soo; Tang, Ke; Wang, X; Silver, R M; Stewart, M D; Pomeroy, J M.
Afiliação
  • Ramanayaka AN; National Institute of Standards & Technology, Gaithersburg, Maryland, 20899, USA. aruna.ramanayaka@nist.gov.
  • Kim HS; National Institute of Standards & Technology, Gaithersburg, Maryland, 20899, USA.
  • Tang K; Department of Electrical and Computer Engineering, University of Maryland, College Park, Maryland, 20742, USA.
  • Wang X; National Institute of Standards & Technology, Gaithersburg, Maryland, 20899, USA.
  • Silver RM; Department of Materials Science and Engineering, University of Maryland, College Park, Maryland, 20742, USA.
  • Stewart MD; National Institute of Standards & Technology, Gaithersburg, Maryland, 20899, USA.
  • Pomeroy JM; Chemical Physics Program, University of Maryland, College Park, Maryland, 20742, USA.
Sci Rep ; 8(1): 1790, 2018 01 29.
Article em En | MEDLINE | ID: mdl-29379057
Using photolithographically defined implant wires for electrical connections, we demonstrate measurement of a scanning tunneling microscope (STM) patterned nanoscale electronic device on Si(100). By eliminating onerous alignment and complex lithography techniques, this approach is accessible to researchers in smaller efforts who may not have access to tools like electron beam lithography. Electrical contact to the nanodevices is achieved by implanting patterned, degenerately doped wires in the substrate using photolithography and commercial low energy ion implantation. We bring several isolated, implanted wires to within the STM scanner's field of view where the STM can detect and smoothly draw contiguous patterns that directly overlap with implant lines for electrical connections. This overlapping provides a two-dimensional (2D) overlap interface with the 2D electron system, in contrast to many state-of-the-art methods that rely on contacting an exposed edge. After the STM pattern is phosphine dosed and overgrown with silicon, photolithography is then used again to align (≈ 160 µm)2 aluminum contact pads onto (≈ 200 µm)2 implanted areas at the ends of the wires. We present detailed results that optimize the spacing of neighboring wires while maintaining electrical isolation after heating to > 1200 °C, a step required for in situ Si surface preparation.

Texto completo: 1 Coleções: 01-internacional Base de dados: MEDLINE Idioma: En Revista: Sci Rep Ano de publicação: 2018 Tipo de documento: Article País de afiliação: Estados Unidos País de publicação: Reino Unido

Texto completo: 1 Coleções: 01-internacional Base de dados: MEDLINE Idioma: En Revista: Sci Rep Ano de publicação: 2018 Tipo de documento: Article País de afiliação: Estados Unidos País de publicação: Reino Unido