Ultraflexible Glassy Semiconductor Fibers for Thermal Sensing and Positioning.

Zhang, Ting; Wang, Zhe; Srinivasan, Bhuvanesh; Wang, Zhixun; Zhang, Jing; Li, Kaiwei; Boussard-Pledel, Catherine; Troles, Johann; Bureau, Bruno; Wei, Lei

Zhang, Ting; Wang, Zhe; Srinivasan, Bhuvanesh; Wang, Zhixun; Zhang, Jing; Li, Kaiwei; Boussard-Pledel, Catherine; Troles, Johann; Bureau, Bruno; Wei, Lei.

Afiliação

Zhang T; School of Electrical and Electronic Engineering , Nanyang Technological University , 50 Nanyang Avenue , 639798 , Singapore.
Wang Z; School of Electrical and Electronic Engineering , Nanyang Technological University , 50 Nanyang Avenue , 639798 , Singapore.
Srinivasan B; Institut des Sciences Chimiques de Rennes, UMR CNRS 6226, University of Rennes , F-35000 Rennes , France.
Wang Z; School of Electrical and Electronic Engineering , Nanyang Technological University , 50 Nanyang Avenue , 639798 , Singapore.
Zhang J; School of Electrical and Electronic Engineering , Nanyang Technological University , 50 Nanyang Avenue , 639798 , Singapore.
Li K; School of Electrical and Electronic Engineering , Nanyang Technological University , 50 Nanyang Avenue , 639798 , Singapore.
Boussard-Pledel C; Institut des Sciences Chimiques de Rennes, UMR CNRS 6226, University of Rennes , F-35000 Rennes , France.
Troles J; Institut des Sciences Chimiques de Rennes, UMR CNRS 6226, University of Rennes , F-35000 Rennes , France.
Bureau B; Institut des Sciences Chimiques de Rennes, UMR CNRS 6226, University of Rennes , F-35000 Rennes , France.
Wei L; School of Electrical and Electronic Engineering , Nanyang Technological University , 50 Nanyang Avenue , 639798 , Singapore.

ACS Appl Mater Interfaces ; 11(2): 2441-2447, 2019 Jan 16.

Article em En | MEDLINE | ID: mdl-30576098

Palavras-chave

fiber fabrication; glassy semiconductors; mechanical flexibility; thermal sensors; thermoelectric fibers; wearable electronics

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Texto completo: 1 Coleções: 01-internacional Base de dados: MEDLINE Idioma: En Revista: ACS Appl Mater Interfaces Assunto da revista: BIOTECNOLOGIA / ENGENHARIA BIOMEDICA Ano de publicação: 2019 Tipo de documento: Article País de afiliação: Singapura

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