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Transfer Printing and its Applications in Flexible Electronic Devices.
Zhou, Honglei; Qin, Weiyang; Yu, Qingmin; Cheng, Huanyu; Yu, Xudong; Wu, Huaping.
Afiliação
  • Zhou H; Department of Engineering Mechanics, School of Mechanics, Civil Engineering and Architecture, Northwestern Polytechnical University, Xi'an 710129, China. hongleizhou@mail.nwpu.edu.cn.
  • Qin W; Department of Engineering Mechanics, School of Mechanics, Civil Engineering and Architecture, Northwestern Polytechnical University, Xi'an 710129, China. mengg@nwpu.edu.cn.
  • Yu Q; Department of Engineering Mechanics, School of Mechanics, Civil Engineering and Architecture, Northwestern Polytechnical University, Xi'an 710129, China. qingminyu@nwpu.edu.cn.
  • Cheng H; State Key Laboratory for Strength and Vibration of Mechanical Structures, Xi'an Jiaotong University, Xi'an 710049, China. qingminyu@nwpu.edu.cn.
  • Yu X; Department of Engineering Science and Mechanics, The Pennsylvania State University, University Park, PA 16802, USA. huanyu.cheng@psu.edu.
  • Wu H; Department of Engineering Mechanics, School of Mechanics, Civil Engineering and Architecture, Northwestern Polytechnical University, Xi'an 710129, China. yuxudong@mail.nwpu.edu.cn.
Nanomaterials (Basel) ; 9(2)2019 Feb 18.
Article em En | MEDLINE | ID: mdl-30781651
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Texto completo: 1 Coleções: 01-internacional Base de dados: MEDLINE Idioma: En Revista: Nanomaterials (Basel) Ano de publicação: 2019 Tipo de documento: Article País de afiliação: China País de publicação: Suíça
Texto completo
Adicionar na Minha BVS
Imprimir
XML
PubMed Links
Buscar no Google

Texto completo: 1 Coleções: 01-internacional Base de dados: MEDLINE Idioma: En Revista: Nanomaterials (Basel) Ano de publicação: 2019 Tipo de documento: Article País de afiliação: China País de publicação: Suíça