Metal Microcapsules Prepared via Electroless Plating at Liquid-Liquid Interface.

Tsuneyoshi, Toshihiko; Cui, Yunlong; Ishida, Hiroaki; Watanabe, Takaichi; Ono, Tsutomu

Tsuneyoshi, Toshihiko; Cui, Yunlong; Ishida, Hiroaki; Watanabe, Takaichi; Ono, Tsutomu.

Afiliação

Tsuneyoshi T; Department of Applied Chemistry , Graduate School of Natural Science and Technology, Okayama University , 3-1-1 , Tsushima-Naka, Kita-Ku, Okayama 700-8530 , Japan.
Cui Y; Department of Applied Chemistry , Graduate School of Natural Science and Technology, Okayama University , 3-1-1 , Tsushima-Naka, Kita-Ku, Okayama 700-8530 , Japan.
Ishida H; Department of Applied Chemistry , Graduate School of Natural Science and Technology, Okayama University , 3-1-1 , Tsushima-Naka, Kita-Ku, Okayama 700-8530 , Japan.
Watanabe T; Department of Applied Chemistry , Graduate School of Natural Science and Technology, Okayama University , 3-1-1 , Tsushima-Naka, Kita-Ku, Okayama 700-8530 , Japan.
Ono T; Department of Applied Chemistry , Graduate School of Natural Science and Technology, Okayama University , 3-1-1 , Tsushima-Naka, Kita-Ku, Okayama 700-8530 , Japan.

Langmuir ; 35(41): 13311-13317, 2019 Oct 15.

Article em En | MEDLINE | ID: mdl-31554404

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Texto completo: 1 Coleções: 01-internacional Base de dados: MEDLINE Idioma: En Revista: Langmuir Assunto da revista: QUIMICA Ano de publicação: 2019 Tipo de documento: Article País de afiliação: Japão País de publicação: Estados Unidos

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