Stress Distribution in Silicon Subjected to Atomic Scale Grinding with a Curved Tool Path.

Fang, Xudong; Kang, Qiang; Ding, Jianjun; Sun, Lin; Maeda, Ryutaro; Jiang, Zhuangde

Fang, Xudong; Kang, Qiang; Ding, Jianjun; Sun, Lin; Maeda, Ryutaro; Jiang, Zhuangde.

Afiliação

Fang X; School of Mechanical Engineering, Xi'an Jiaotong University, Xi'an 710049, China.
Kang Q; State Key Laboratory for Manufacturing Systems Engineering, International Joint Laboratory for Micro/Nano Manufacturing and Measurement Technology, Xi'an Jiaotong University, Xi'an 710056, China.
Ding J; School of Mechanical Engineering, Xi'an Jiaotong University, Xi'an 710049, China.
Sun L; State Key Laboratory for Manufacturing Systems Engineering, International Joint Laboratory for Micro/Nano Manufacturing and Measurement Technology, Xi'an Jiaotong University, Xi'an 710056, China.
Maeda R; State Key Laboratory for Manufacturing Systems Engineering, International Joint Laboratory for Micro/Nano Manufacturing and Measurement Technology, Xi'an Jiaotong University, Xi'an 710056, China.
Jiang Z; Shaanxi Key Laboratory of Non-traditional Machining, Xi'an Technological University, Xi'an 710021, China.

Materials (Basel) ; 13(7)2020 Apr 06.

Article em En | MEDLINE | ID: mdl-32268524

Palavras-chave

atomic grinding; curved tool path; molecular dynamics; stress distribution

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Texto completo: 1 Coleções: 01-internacional Base de dados: MEDLINE Idioma: En Revista: Materials (Basel) Ano de publicação: 2020 Tipo de documento: Article País de afiliação: China País de publicação: Suíça

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