In Situ EBSD Study on the Microstructural Transformation of the Ni5W Substrate for Coated Conductors.

The microstructure and texture evolution of Ni-5 at%W (Ni5W) alloy substrates were investigated by in situ tensile testing along the rolling direction (RD), transverse direction (TD), and at 45° to the RD (45°-RD), as well as by electron backscatter diffraction characterization. The tensile stress direction had a significant influence on the texture evolution. The cubic texture in the Ni-5 at%W alloy exhibited severe degradation when the tensile angle was 45°-RD. In contrast, the cubic texture was relatively stable under high deformation along the RD or TD. It was found that the slip line system in the 45°-RD specimen was the key to the contrasting behavior. The effect of the tensile testing angle on the cubic texture evolution for Ni­W substrates was investigated, and the corresponding effect on the superconducting properties of coated materials was studied.