Numerical homogenization of thermal conductivity of particle-filled thermal interface material by fast Fourier transform method.

Lu, Xiaoxin; Fu, Xueqiong; Lu, Jibao; Sun, Rong; Xu, Jianbin; Yan, Changzeng; Wong, Ching-Ping

Lu, Xiaoxin; Fu, Xueqiong; Lu, Jibao; Sun, Rong; Xu, Jianbin; Yan, Changzeng; Wong, Ching-Ping.

Afiliação

Lu X; Shenzhen Institute of Advanced Electronic Materials, Shenzhen Institutes of Advanced Technology, Chinese Academy of Sciences, Shenzhen 518103, People's Republic of China.
Fu X; Shenzhen Institutes of Advanced Technology, Chinese Academy of Sciences, Shenzhen 518055, People's Republic of China.
Lu J; Shenzhen Institute of Advanced Electronic Materials, Shenzhen Institutes of Advanced Technology, Chinese Academy of Sciences, Shenzhen 518103, People's Republic of China.
Sun R; Shenzhen Institutes of Advanced Technology, Chinese Academy of Sciences, Shenzhen 518055, People's Republic of China.
Xu J; Shenzhen Institute of Advanced Electronic Materials, Shenzhen Institutes of Advanced Technology, Chinese Academy of Sciences, Shenzhen 518103, People's Republic of China.
Yan C; Shenzhen Institutes of Advanced Technology, Chinese Academy of Sciences, Shenzhen 518055, People's Republic of China.
Wong CP; Shenzhen Institute of Advanced Electronic Materials, Shenzhen Institutes of Advanced Technology, Chinese Academy of Sciences, Shenzhen 518103, People's Republic of China.

Nanotechnology ; 32(26)2021 Apr 09.

Article em En | MEDLINE | ID: mdl-33652420

Palavras-chave

fast Fourier transform; interface thermal resistance; particle reinforcement; thermal properties

Texto completo

Adicionar na Minha BVS

Imprimir

XML

PubMed Links

Buscar no Google

Texto completo: 1 Coleções: 01-internacional Base de dados: MEDLINE Idioma: En Revista: Nanotechnology Ano de publicação: 2021 Tipo de documento: Article País de publicação: Reino Unido

Texto completo

Adicionar na Minha BVS

Imprimir

XML

PubMed Links

Buscar no Google