Observation of void formation patterns in SnAg films undergoing electromigration and simulation using random walk methods.

Jin, Zhi; Shen, Yu-An; Zuo, Yang; Chan, Y C; Mannan, S H; Nishikawa, Hiroshi

Jin, Zhi; Shen, Yu-An; Zuo, Yang; Chan, Y C; Mannan, S H; Nishikawa, Hiroshi.

Afiliação

Jin Z; Graduate School of Engineering, Osaka University, Suita, Japan. jinzhi711@gmail.com.
Shen YA; Joining and Welding Research Institute (JWRI), Osaka University, Ibaraki, 5600047, Japan. jinzhi711@gmail.com.
Zuo Y; Physics Department, School of Natural & Mathematical Sciences, King's College London, Strand, London, WC2R2LS, UK. jinzhi711@gmail.com.
Chan YC; Joining and Welding Research Institute (JWRI), Osaka University, Ibaraki, 5600047, Japan.
Mannan SH; Feng Chia University, Taichung, Taiwan (R.O.C.).
Nishikawa H; Physics Department, School of Natural & Mathematical Sciences, King's College London, Strand, London, WC2R2LS, UK.

Sci Rep ; 11(1): 8668, 2021 Apr 21.

Article em En | MEDLINE | ID: mdl-33883649

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Texto completo: 1 Coleções: 01-internacional Base de dados: MEDLINE Tipo de estudo: Clinical_trials / Prognostic_studies Idioma: En Revista: Sci Rep Ano de publicação: 2021 Tipo de documento: Article País de afiliação: Japão País de publicação: Reino Unido

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