Your browser doesn't support javascript.
loading
Thermal Conductivity of ß-Phase Ga2O3 and (AlxGa1-x)2O3 Heteroepitaxial Thin Films.
Song, Yiwen; Ranga, Praneeth; Zhang, Yingying; Feng, Zixuan; Huang, Hsien-Lien; Santia, Marco D; Badescu, Stefan C; Gonzalez-Valle, C Ulises; Perez, Carlos; Ferri, Kevin; Lavelle, Robert M; Snyder, David W; Klein, Brianna A; Deitz, Julia; Baca, Albert G; Maria, Jon-Paul; Ramos-Alvarado, Bladimir; Hwang, Jinwoo; Zhao, Hongping; Wang, Xiaojia; Krishnamoorthy, Sriram; Foley, Brian M; Choi, Sukwon.
Afiliação
  • Song Y; Department of Mechanical Engineering, The Pennsylvania State University, University Park, Pennsylvania 16802, United States.
  • Ranga P; Department of Electrical and Computer Engineering, University of Utah, Salt Lake City, Utah 84112, United States.
  • Zhang Y; Department of Mechanical Engineering, University of Minnesota, Minneapolis, Minnesota 55455, United States.
  • Feng Z; Department of Electrical and Computer Engineering, The Ohio State University, Columbus, Ohio 43210, United States.
  • Huang HL; Department of Materials Science and Engineering, The Ohio State University, Columbus, Ohio 43210, United States.
  • Santia MD; Sensors Directorate, Air Force Research Laboratory, Wright-Patterson Air Force Base, Ohio 45433, United States.
  • Badescu SC; Sensors Directorate, Air Force Research Laboratory, Wright-Patterson Air Force Base, Ohio 45433, United States.
  • Gonzalez-Valle CU; Department of Mechanical Engineering, The Pennsylvania State University, University Park, Pennsylvania 16802, United States.
  • Perez C; Department of Mechanical Engineering, The Pennsylvania State University, University Park, Pennsylvania 16802, United States.
  • Ferri K; Department of Materials Science and Engineering, The Pennsylvania State University, University Park, Pennsylvania 16802, United States.
  • Lavelle RM; Electronic Materials and Devices Department, Applied Research Laboratory, University Park, Pennsylvania 16802, United States.
  • Snyder DW; Electronic Materials and Devices Department, Applied Research Laboratory, University Park, Pennsylvania 16802, United States.
  • Klein BA; Sandia National Laboratories, Albuquerque, New Mexico 87185, United States.
  • Deitz J; Sandia National Laboratories, Albuquerque, New Mexico 87185, United States.
  • Baca AG; Sandia National Laboratories, Albuquerque, New Mexico 87185, United States.
  • Maria JP; Department of Materials Science and Engineering, The Pennsylvania State University, University Park, Pennsylvania 16802, United States.
  • Ramos-Alvarado B; Department of Mechanical Engineering, The Pennsylvania State University, University Park, Pennsylvania 16802, United States.
  • Hwang J; Department of Materials Science and Engineering, The Ohio State University, Columbus, Ohio 43210, United States.
  • Zhao H; Department of Electrical and Computer Engineering, The Ohio State University, Columbus, Ohio 43210, United States.
  • Wang X; Department of Materials Science and Engineering, The Ohio State University, Columbus, Ohio 43210, United States.
  • Krishnamoorthy S; Department of Mechanical Engineering, University of Minnesota, Minneapolis, Minnesota 55455, United States.
  • Foley BM; Department of Electrical and Computer Engineering, University of Utah, Salt Lake City, Utah 84112, United States.
  • Choi S; Department of Mechanical Engineering, The Pennsylvania State University, University Park, Pennsylvania 16802, United States.
ACS Appl Mater Interfaces ; 13(32): 38477-38490, 2021 Aug 18.
Article em En | MEDLINE | ID: mdl-34370459

Texto completo: 1 Coleções: 01-internacional Base de dados: MEDLINE Idioma: En Revista: ACS Appl Mater Interfaces Assunto da revista: BIOTECNOLOGIA / ENGENHARIA BIOMEDICA Ano de publicação: 2021 Tipo de documento: Article País de afiliação: Estados Unidos País de publicação: Estados Unidos

Texto completo: 1 Coleções: 01-internacional Base de dados: MEDLINE Idioma: En Revista: ACS Appl Mater Interfaces Assunto da revista: BIOTECNOLOGIA / ENGENHARIA BIOMEDICA Ano de publicação: 2021 Tipo de documento: Article País de afiliação: Estados Unidos País de publicação: Estados Unidos