Use of Hyperspectral Imaging for the Quantification of Organic Contaminants on Copper Surfaces for Electronic Applications.

Englert, Tim; Gruber, Florian; Stiedl, Jan; Green, Simon; Jacob, Timo; Rebner, Karsten; Grählert, Wulf

Englert, Tim; Gruber, Florian; Stiedl, Jan; Green, Simon; Jacob, Timo; Rebner, Karsten; Grählert, Wulf.

Afiliação

Englert T; Robert Bosch GmbH, Automotive Electronics, Postfach 1342, 72703 Reutlingen, Germany.
Gruber F; Institute of Electrochemistry, Ulm University, Albert-Einstein-Allee 47, 89081 Ulm, Germany.
Stiedl J; Fraunhofer Institute for Material and Beam Technology IWS, Winterbergstraße 28, 01277 Dresden, Germany.
Green S; Robert Bosch GmbH, Automotive Electronics, Postfach 1342, 72703 Reutlingen, Germany.
Jacob T; Robert Bosch GmbH, Automotive Electronics, Postfach 1342, 72703 Reutlingen, Germany.
Rebner K; Institute of Electrochemistry, Ulm University, Albert-Einstein-Allee 47, 89081 Ulm, Germany.
Grählert W; Process Analysis and Technology PA & T, Reutlingen University, Alteburgstraße 150, 72762 Reutlingen, Germany.

Sensors (Basel) ; 21(16)2021 Aug 19.

Article em En | MEDLINE | ID: mdl-34451034

Assuntos

Cobre; Imageamento Hiperespectral; Eletrônica; Aprendizado de Máquina; Máquina de Vetores de Suporte

Palavras-chave

AES; HSI; RF; SVM; XPS; cleaning after soldering; cleanliness; elastic net; machine learning; multivariate analysis; organic residues; spectral imaging

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Texto completo: 1 Coleções: 01-internacional Base de dados: MEDLINE Assunto principal: Cobre / Imageamento Hiperespectral Tipo de estudo: Prognostic_studies Idioma: En Revista: Sensors (Basel) Ano de publicação: 2021 Tipo de documento: Article País de afiliação: Alemanha País de publicação: Suíça

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