Materials informatics platform with three dimensional structures, workflow and thermoelectric applications.

Yao, Mingjia; Wang, Yuxiang; Li, Xin; Sheng, Ye; Huo, Haiyang; Xi, Lili; Yang, Jiong; Zhang, Wenqing

Yao, Mingjia; Wang, Yuxiang; Li, Xin; Sheng, Ye; Huo, Haiyang; Xi, Lili; Yang, Jiong; Zhang, Wenqing.

Afiliação

Yao M; Materials Genome Institute, Shanghai University, Shanghai, 200444, China.
Wang Y; Materials Genome Institute, Shanghai University, Shanghai, 200444, China.
Li X; Materials Genome Institute, Shanghai University, Shanghai, 200444, China.
Sheng Y; State Key Laboratory of Functional Materials for Informatics, Shanghai Institute of Microsystem and Information Technology, Chinese Academy of Sciences, Shanghai, 200050, China.
Huo H; Materials Genome Institute, Shanghai University, Shanghai, 200444, China.
Xi L; Materials Genome Institute, Shanghai University, Shanghai, 200444, China.
Yang J; Materials Genome Institute, Shanghai University, Shanghai, 200444, China.
Zhang W; Materials Genome Institute, Shanghai University, Shanghai, 200444, China. jiongy@t.shu.edu.cn.

Sci Data ; 8(1): 236, 2021 09 07.

Article em En | MEDLINE | ID: mdl-34493728

Texto completo

Adicionar na Minha BVS

Imprimir

XML

PubMed Links

Buscar no Google

Texto completo: 1 Coleções: 01-internacional Base de dados: MEDLINE Idioma: En Revista: Sci Data Ano de publicação: 2021 Tipo de documento: Article País de afiliação: China País de publicação: Reino Unido

Texto completo

Adicionar na Minha BVS

Imprimir

XML

PubMed Links

Buscar no Google