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Crack-inducing Strain Sensor Array using Inkjet-Printed Silver Thin Film for Underplate and Off-centered Force Sensing Applications.
Choi, Seongdae; Lee, Seunghwan; Lee, Byeongmoon; Yoon, Jinsu; Lee, Chea-Young; Kim, Taehoon; Hong, Yongtaek.
Afiliação
  • Choi S; Department of Electrical and Computer Engineering, Inter-University Semiconductor Research Center (ISRC), Seoul National University, Seoul08826, Republic of Korea.
  • Lee S; Department of Electrical and Computer Engineering, Inter-University Semiconductor Research Center (ISRC), Seoul National University, Seoul08826, Republic of Korea.
  • Lee B; Department of Electrical and Computer Engineering, Inter-University Semiconductor Research Center (ISRC), Seoul National University, Seoul08826, Republic of Korea.
  • Yoon J; Department of Electrical and Computer Engineering, Inter-University Semiconductor Research Center (ISRC), Seoul National University, Seoul08826, Republic of Korea.
  • Lee CY; Department of Electrical and Computer Engineering, Inter-University Semiconductor Research Center (ISRC), Seoul National University, Seoul08826, Republic of Korea.
  • Kim T; Department of Electrical and Computer Engineering, Inter-University Semiconductor Research Center (ISRC), Seoul National University, Seoul08826, Republic of Korea.
  • Hong Y; Department of Electrical and Computer Engineering, Inter-University Semiconductor Research Center (ISRC), Seoul National University, Seoul08826, Republic of Korea.
ACS Appl Mater Interfaces ; 15(3): 4487-4494, 2023 Jan 25.
Article em En | MEDLINE | ID: mdl-36642889
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Texto completo: 1 Coleções: 01-internacional Base de dados: MEDLINE Idioma: En Revista: ACS Appl Mater Interfaces Assunto da revista: BIOTECNOLOGIA / ENGENHARIA BIOMEDICA Ano de publicação: 2023 Tipo de documento: Article País de publicação: Estados Unidos
Texto completo
Adicionar na Minha BVS
Imprimir
XML
PubMed Links
Buscar no Google

Texto completo: 1 Coleções: 01-internacional Base de dados: MEDLINE Idioma: En Revista: ACS Appl Mater Interfaces Assunto da revista: BIOTECNOLOGIA / ENGENHARIA BIOMEDICA Ano de publicação: 2023 Tipo de documento: Article País de publicação: Estados Unidos