Interfacial Characterization and Thermal Conductivity of Diamond/Cu Composites Prepared by Liquid-Solid Separation Technique.

Li, Yaqiang; Zhou, Hongyu; Wu, Chunjing; Yin, Zheng; Liu, Chang; Liu, Junyou; Shi, Zhongliang

Li, Yaqiang; Zhou, Hongyu; Wu, Chunjing; Yin, Zheng; Liu, Chang; Liu, Junyou; Shi, Zhongliang.

Afiliação

Li Y; Institute for Advanced Materials and Technology, University of Science and Technology Beijing, Beijing 100083, China.
Zhou H; National Center for Materials Service Safety, University of Science and Technology Beijing, Beijing 100083, China.
Wu C; School of Materials Science and Engineering, University of Science and Technology Beijing, Beijing 100083, China.
Yin Z; Qingdao Tianhe Manufacturing Transformation and Upgrading Research Institute Co., Ltd., Qingdao 266400, China.
Liu C; Institute for Advanced Materials and Technology, University of Science and Technology Beijing, Beijing 100083, China.
Liu J; School of Materials Science and Engineering, University of Science and Technology Beijing, Beijing 100083, China.
Shi Z; School of Materials Science and Engineering, Baise University, Baise 533000, China.

Nanomaterials (Basel) ; 13(5)2023 Feb 26.

Article em En | MEDLINE | ID: mdl-36903755

Palavras-chave

diamond/Cu composite; liquid-solid separation; surface modification; thermal conductivity

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Texto completo: 1 Coleções: 01-internacional Base de dados: MEDLINE Idioma: En Revista: Nanomaterials (Basel) Ano de publicação: 2023 Tipo de documento: Article País de afiliação: China País de publicação: Suíça

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