Highly Robust and Strain-Resilient Thin Film Conductors Featuring Brittle Materials.

Chen, Kai; Zhang, Linyuan; Wu, Kai; Yang, Chao; Wang, Ruihong; Xu, Canhua; Zhang, Jinyu; Liu, Gang; Sun, Jun

Chen, Kai; Zhang, Linyuan; Wu, Kai; Yang, Chao; Wang, Ruihong; Xu, Canhua; Zhang, Jinyu; Liu, Gang; Sun, Jun.

Afiliação

Chen K; State Key Laboratory for Mechanical Behavior of Materials, Xi'an Jiaotong University, Xi'an 710049, P. R. China.
Zhang L; School of Biomedical Engineering, The Fourth Military Medical University, Xi'an 710032, P. R. China.
Wu K; State Key Laboratory for Mechanical Behavior of Materials, Xi'an Jiaotong University, Xi'an 710049, P. R. China.
Yang C; School of Materials Science and Engineering, Xi'an University of Technology, Xi'an 710048, P. R. China.
Wang R; School of Materials Science and Engineering, Xi'an University of Technology, Xi'an 710048, P. R. China.
Xu C; School of Biomedical Engineering, The Fourth Military Medical University, Xi'an 710032, P. R. China.
Zhang J; State Key Laboratory for Mechanical Behavior of Materials, Xi'an Jiaotong University, Xi'an 710049, P. R. China.
Liu G; State Key Laboratory for Mechanical Behavior of Materials, Xi'an Jiaotong University, Xi'an 710049, P. R. China.
Sun J; State Key Laboratory for Mechanical Behavior of Materials, Xi'an Jiaotong University, Xi'an 710049, P. R. China.

Nano Lett ; 23(14): 6619-6628, 2023 Jul 26.

Article em En | MEDLINE | ID: mdl-37409851

Palavras-chave

brittle film; conductivity; cracking; electrical self-repairing; strain insensitivity

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Texto completo: 1 Coleções: 01-internacional Base de dados: MEDLINE Idioma: En Revista: Nano Lett Ano de publicação: 2023 Tipo de documento: Article País de publicação: Estados Unidos

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