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Charge Dispersion Strategy for High-Performance and Rain-Proof Triboelectric Nanogenerator.
Sun, Qizeng; Ren, Guozhang; He, Shunhao; Tang, Biao; Li, Yijia; Wei, Yuewen; Shi, Xuewen; Tan, Shenxing; Yan, Ren; Wang, Kaili; Yu, Liuyingzi; Wang, Junjie; Gao, Kun; Zhu, Chengcheng; Song, Yaxin; Gong, Zhongyan; Lu, Gang; Huang, Wei; Yu, Hai-Dong.
Afiliação
  • Sun Q; Frontiers Science Center for Flexible Electronics, Xi'an Institute of Flexible Electronics, Xi'an Institute of Biomedical Materials & Engineering, Northwestern Polytechnical University, 127 West Youyi Road, Xi'an, 710072, P. R. China.
  • Ren G; School of Flexible Electronics (Future Technologies), Institute of Advanced Materials, Key Laboratory of Flexible Electronics, Nanjing Tech University, 30 South Puzhu Road, Nanjing, 211816, P. R. China.
  • He S; Frontiers Science Center for Flexible Electronics, Xi'an Institute of Flexible Electronics, Xi'an Institute of Biomedical Materials & Engineering, Northwestern Polytechnical University, 127 West Youyi Road, Xi'an, 710072, P. R. China.
  • Tang B; School of Flexible Electronics (Future Technologies), Institute of Advanced Materials, Key Laboratory of Flexible Electronics, Nanjing Tech University, 30 South Puzhu Road, Nanjing, 211816, P. R. China.
  • Li Y; School of Flexible Electronics (Future Technologies), Institute of Advanced Materials, Key Laboratory of Flexible Electronics, Nanjing Tech University, 30 South Puzhu Road, Nanjing, 211816, P. R. China.
  • Wei Y; Frontiers Science Center for Flexible Electronics, Xi'an Institute of Flexible Electronics, Xi'an Institute of Biomedical Materials & Engineering, Northwestern Polytechnical University, 127 West Youyi Road, Xi'an, 710072, P. R. China.
  • Shi X; Frontiers Science Center for Flexible Electronics, Xi'an Institute of Flexible Electronics, Xi'an Institute of Biomedical Materials & Engineering, Northwestern Polytechnical University, 127 West Youyi Road, Xi'an, 710072, P. R. China.
  • Tan S; Frontiers Science Center for Flexible Electronics, Xi'an Institute of Flexible Electronics, Xi'an Institute of Biomedical Materials & Engineering, Northwestern Polytechnical University, 127 West Youyi Road, Xi'an, 710072, P. R. China.
  • Yan R; Frontiers Science Center for Flexible Electronics, Xi'an Institute of Flexible Electronics, Xi'an Institute of Biomedical Materials & Engineering, Northwestern Polytechnical University, 127 West Youyi Road, Xi'an, 710072, P. R. China.
  • Wang K; Frontiers Science Center for Flexible Electronics, Xi'an Institute of Flexible Electronics, Xi'an Institute of Biomedical Materials & Engineering, Northwestern Polytechnical University, 127 West Youyi Road, Xi'an, 710072, P. R. China.
  • Yu L; Frontiers Science Center for Flexible Electronics, Xi'an Institute of Flexible Electronics, Xi'an Institute of Biomedical Materials & Engineering, Northwestern Polytechnical University, 127 West Youyi Road, Xi'an, 710072, P. R. China.
  • Wang J; School of Flexible Electronics (Future Technologies), Institute of Advanced Materials, Key Laboratory of Flexible Electronics, Nanjing Tech University, 30 South Puzhu Road, Nanjing, 211816, P. R. China.
  • Gao K; School of Flexible Electronics (Future Technologies), Institute of Advanced Materials, Key Laboratory of Flexible Electronics, Nanjing Tech University, 30 South Puzhu Road, Nanjing, 211816, P. R. China.
  • Zhu C; School of Flexible Electronics (Future Technologies), Institute of Advanced Materials, Key Laboratory of Flexible Electronics, Nanjing Tech University, 30 South Puzhu Road, Nanjing, 211816, P. R. China.
  • Song Y; School of Flexible Electronics (Future Technologies), Institute of Advanced Materials, Key Laboratory of Flexible Electronics, Nanjing Tech University, 30 South Puzhu Road, Nanjing, 211816, P. R. China.
  • Gong Z; School of Flexible Electronics (Future Technologies), Institute of Advanced Materials, Key Laboratory of Flexible Electronics, Nanjing Tech University, 30 South Puzhu Road, Nanjing, 211816, P. R. China.
  • Lu G; School of Flexible Electronics (Future Technologies), Institute of Advanced Materials, Key Laboratory of Flexible Electronics, Nanjing Tech University, 30 South Puzhu Road, Nanjing, 211816, P. R. China.
  • Huang W; School of Flexible Electronics (Future Technologies), Institute of Advanced Materials, Key Laboratory of Flexible Electronics, Nanjing Tech University, 30 South Puzhu Road, Nanjing, 211816, P. R. China.
  • Yu HD; School of Flexible Electronics (Future Technologies), Institute of Advanced Materials, Key Laboratory of Flexible Electronics, Nanjing Tech University, 30 South Puzhu Road, Nanjing, 211816, P. R. China.
Adv Mater ; 36(8): e2307918, 2024 Feb.
Article em En | MEDLINE | ID: mdl-37852010
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Texto completo: 1 Coleções: 01-internacional Base de dados: MEDLINE Idioma: En Revista: Adv Mater Assunto da revista: BIOFISICA / QUIMICA Ano de publicação: 2024 Tipo de documento: Article
Texto completo
Adicionar na Minha BVS
Imprimir
XML
PubMed Links
Buscar no Google

Texto completo: 1 Coleções: 01-internacional Base de dados: MEDLINE Idioma: En Revista: Adv Mater Assunto da revista: BIOFISICA / QUIMICA Ano de publicação: 2024 Tipo de documento: Article