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Determining hot-carrier transport dynamics from terahertz emission.
Taghinejad, Mohammad; Xia, Chenyi; Hrton, Martin; Lee, Kyu-Tae; Kim, Andrew S; Li, Qitong; Guzelturk, Burak; Kalousek, Radek; Xu, Fenghao; Cai, Wenshan; Lindenberg, Aaron M; Brongersma, Mark L.
Afiliação
  • Taghinejad M; Geballe Laboratory for Advanced Materials, Stanford University, Stanford, CA, USA.
  • Xia C; Department of Materials Science and Engineering, Stanford University, Stanford, CA, USA.
  • Hrton M; Department of Materials Science and Engineering, Stanford University, Stanford, CA, USA.
  • Lee KT; Institute of Physical Engineering, Faculty of Mechanical Engineering, Brno University of Technology, Czech Republic.
  • Kim AS; Central European Institute of Technology (CEITEC), Brno University of Technology, Czech Republic.
  • Li Q; School of Electrical and Computer Engineering, Georgia Institute of Technology, Atlanta, GA, USA.
  • Guzelturk B; School of Electrical and Computer Engineering, Georgia Institute of Technology, Atlanta, GA, USA.
  • Kalousek R; Geballe Laboratory for Advanced Materials, Stanford University, Stanford, CA, USA.
  • Xu F; X-ray Science Division, Argonne National Laboratory, Lemont, IL, USA.
  • Cai W; Institute of Physical Engineering, Faculty of Mechanical Engineering, Brno University of Technology, Czech Republic.
  • Lindenberg AM; Central European Institute of Technology (CEITEC), Brno University of Technology, Czech Republic.
  • Brongersma ML; Geballe Laboratory for Advanced Materials, Stanford University, Stanford, CA, USA.
Science ; 382(6668): 299-305, 2023 Oct 20.
Article em En | MEDLINE | ID: mdl-37856614

Texto completo: 1 Coleções: 01-internacional Base de dados: MEDLINE Idioma: En Revista: Science Ano de publicação: 2023 Tipo de documento: Article País de afiliação: Estados Unidos País de publicação: Estados Unidos

Texto completo: 1 Coleções: 01-internacional Base de dados: MEDLINE Idioma: En Revista: Science Ano de publicação: 2023 Tipo de documento: Article País de afiliação: Estados Unidos País de publicação: Estados Unidos