Transepithelial Electrical Impedance Increase Following Porous Substrate Electroporation Enables Label-Free Delivery.

Brooks, Justin R; Heiman, Tyler C; Lorenzen, Sawyer R; Mungloo, Ikhlaas; Mirfendereski, Siamak; Park, Jae Sung; Yang, Ruiguo

Brooks, Justin R; Heiman, Tyler C; Lorenzen, Sawyer R; Mungloo, Ikhlaas; Mirfendereski, Siamak; Park, Jae Sung; Yang, Ruiguo.

Afiliação

Brooks JR; Department of Mechanical and Materials Engineering, University of Nebraska-Lincoln, Lincoln, NE, 68588, USA.
Heiman TC; Department of Mechanical and Materials Engineering, University of Nebraska-Lincoln, Lincoln, NE, 68588, USA.
Lorenzen SR; Department of Mechanical and Materials Engineering, University of Nebraska-Lincoln, Lincoln, NE, 68588, USA.
Mungloo I; Department of Mechanical and Materials Engineering, University of Nebraska-Lincoln, Lincoln, NE, 68588, USA.
Mirfendereski S; Department of Mechanical and Materials Engineering, University of Nebraska-Lincoln, Lincoln, NE, 68588, USA.
Park JS; Department of Mechanical and Materials Engineering, University of Nebraska-Lincoln, Lincoln, NE, 68588, USA.
Yang R; Department of Mechanical and Materials Engineering, University of Nebraska-Lincoln, Lincoln, NE, 68588, USA.

bioRxiv ; 2023 Nov 03.

Article em En | MEDLINE | ID: mdl-37905105

Palavras-chave

label-free delivery; porous substrate electroporation; transepithelial electrical impedance

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Texto completo: 1 Coleções: 01-internacional Base de dados: MEDLINE Idioma: En Revista: BioRxiv Ano de publicação: 2023 Tipo de documento: Article País de afiliação: Estados Unidos País de publicação: Estados Unidos

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