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Non-equilibrium compression achieving high sensitivity and linearity for iontronic pressure sensors.
Yang, Jing; Li, Zhibin; Wu, Ying; Shen, Yong; Zhang, Ming; Chen, Bin; Yuan, Guojiang; Xiao, Songhua; Feng, Jiansong; Zhang, Xu; Tang, Yuwei; Ding, Sunan; Chen, Xiaolong; Wang, Taihong.
Afiliação
  • Yang J; Department of Electrical and Electronic Engineering, Southern University of Science and Technology, Shenzhen 518055, China.
  • Li Z; Department of Electrical and Electronic Engineering, Southern University of Science and Technology, Shenzhen 518055, China.
  • Wu Y; School of Microelectronics, Southern University of Science and Technology, Shenzhen 518055, China.
  • Shen Y; Department of Electrical and Electronic Engineering, Southern University of Science and Technology, Shenzhen 518055, China.
  • Zhang M; Key Laboratory for Micro/Nano Optoelectronic Devices of Ministry of Education, Engineering Research Center of Advanced Semiconductor Technology and Application of Ministry of Education, Changsha Semiconductor Technology and Application Innovation Research Institute, College of Semiconductors (Colleg
  • Chen B; School of Environmental and Chemical Engineering, Yanshan University, Qinhuangdao 066004, China.
  • Yuan G; Department of Electrical and Electronic Engineering, Southern University of Science and Technology, Shenzhen 518055, China.
  • Xiao S; Department of Electrical and Electronic Engineering, Southern University of Science and Technology, Shenzhen 518055, China.
  • Feng J; Department of Electrical and Electronic Engineering, Southern University of Science and Technology, Shenzhen 518055, China.
  • Zhang X; Department of Electrical and Electronic Engineering, Southern University of Science and Technology, Shenzhen 518055, China.
  • Tang Y; Department of Electrical and Electronic Engineering, Southern University of Science and Technology, Shenzhen 518055, China.
  • Ding S; School of Integrated Circuits, Nanjing University, Suzhou 215163, China. Electronic address: dingsunan@nju.edu.cn.
  • Chen X; Department of Electrical and Electronic Engineering, Southern University of Science and Technology, Shenzhen 518055, China. Electronic address: chenxl@sustech.edu.cn.
  • Wang T; Department of Electrical and Electronic Engineering, Southern University of Science and Technology, Shenzhen 518055, China; School of Microelectronics, Southern University of Science and Technology, Shenzhen 518055, China. Electronic address: wangth@sustech.edu.cn.
Sci Bull (Beijing) ; 69(14): 2221-2230, 2024 Jul 30.
Article em En | MEDLINE | ID: mdl-38782658
ABSTRACT
Flexible pressure sensors with high sensitivity and linearity are highly desirable for robot sensing and human physiological signal detection. However, the current strategies for stabilizing axial microstructures (e.g., micro-pyramids) are mainly susceptible to structural stiffening during compression, thereby limiting the realization of high sensitivity and linearity. Here, we report a bending-induced non-equilibrium compression process that effectively enhances the compressibility of microstructures, thereby crucially improving the efficiency of interfacial area growth of electric double layer (EDL). Based on this principle, we fabricate an iontronic flexible pressure sensor with vertical graphene (VG) array electrodes. Ultra-high sensitivity (185.09 kPa-1) and linearity (R2 = 0.9999) are realized over a wide pressure range (0.49 Pa-66.67 kPa). It also exhibits remarkable mechanical stability during compression and bending. The sensor is successfully employed in a robotic gripping task to recognize the targets of different materials and shapes based on a multilayer perception (MLP) neural network. It opens the door to realizing haptic sensing capabilities for robotic hands and prosthetic limbs.
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Texto completo: 1 Coleções: 01-internacional Base de dados: MEDLINE Idioma: En Revista: Sci Bull (Beijing) Ano de publicação: 2024 Tipo de documento: Article País de afiliação: China

Texto completo: 1 Coleções: 01-internacional Base de dados: MEDLINE Idioma: En Revista: Sci Bull (Beijing) Ano de publicação: 2024 Tipo de documento: Article País de afiliação: China