Mode I Fatigue and Fracture Assessment of Polyimide-Epoxy and Silicon-Epoxy Interfaces in Chip-Package Components.

Semiconductor advancements demand greater integrated circuit density, structural miniaturization, and complex material combinations, resulting in stress concentrations from property mismatches. This study investigates the failure in two types of interfaces found in chip packages: silicon-epoxy mold compound (EMC) and polyimide-EMC. These interfaces were subjected to quasi-static and fatigue loading conditions. Employing a compliance-based beam method, the tests determined interfacial critical fracture energy values, (GIC), of 0.051 N/mm and 0.037 N/mm for the silicon-EMC and polyimide-EMC interfaces, respectively. Fatigue testing on the polyimide-epoxy interface revealed a fatigue threshold strain energy, (Gth), of 0.042 N/mm. We also observed diverse failure modes and discuss potential mechanical failures in multi-layer chip packages. The findings of this study can contribute to the prediction and mitigation of failure modes in the analyzed chip packaging. The obtained threshold energy and crack growth rate provide insights for designing safe lives for bi-material interfaces in chip packaging under cyclic loads. These insights can guide future research directions, emphasizing the improvement of material properties and exploration of the influence of manufacturing parameters on delamination in multilayer semiconductors.

Cohesive Properties of Bimaterial Interfaces in Semiconductors: Experimental Study and Numerical Simulation Using an Inverse Cohesive Contact Approach.

Examining crack propagation at the interface of bimaterial components under various conditions is essential for improving the reliability of semiconductor designs. However, the fracture behavior of bimaterial interfaces has been relatively underexplored in the literature, particularly in terms of numerical predictions. Numerical simulations offer vital insights into the evolution of interfacial damage and stress distribution in wafers, showcasing their dependence on material properties. The lack of knowledge about specific interfaces poses a significant obstacle to the development of new products and necessitates active remediation for further progress. The objective of this paper is twofold: firstly, to experimentally investigate the behavior of bimaterial interfaces commonly found in semiconductors under quasi-static loading conditions, and secondly, to determine their respective interfacial cohesive properties using an inverse cohesive zone modeling approach. For this purpose, double cantilever beam specimens were manufactured that allow Mode I static fracture analysis of the interfaces. A compliance-based method was used to obtain the crack size during the tests and the Mode I energy release rate (GIc). Experimental results were utilized to simulate the behavior of different interfaces under specific test conditions in Abaqus. The simulation aimed to extract the interfacial cohesive contact properties of the studied bimaterial interfaces. These properties enable designers to predict the strength of the interfaces, particularly under Mode I loading conditions. To this extent, the cohesive zone modeling (CZM) assisted in defining the behavior of the damage propagation through the bimaterial interfaces. As a result, for the silicon-epoxy molding compound (EMC) interface, the results for maximum strength and GIc are, respectively, 26 MPa and 0.05 N/mm. The second interface tested consisted of polyimide and silicon oxide between the silicon and EMC layers, and the results obtained are 21.5 MPa for the maximum tensile strength and 0.02 N/mm for GIc. This study's findings aid in predicting and mitigating failure modes in the studied chip packaging. The insights offer directions for future research, focusing on enhancing material properties and exploring the impact of manufacturing parameters and temperature conditions on delamination in multilayer semiconductors.

Tensile Strength and Mode I Fracture Toughness of Polymer Concretes Enhanced with Glass Fibers and Metal Chips.

This study experimentally investigates the influence of metal chips and glass fibers on the mode I fracture toughness, energy absorption, and tensile strength of polymer concretes (PCs) manufactured by waste aggregates. A substantial portion of the materials employed in manufacturing and enhancing the tested polymer concrete are sourced from waste material. To achieve this, semi-circular bend (SCB) samples were fabricated, both with and without a central crack, to analyze the strength and fracture behavior of the composite specimens. The specimens incorporated varying weight percentages comprising 50 wt% coarse mineral aggregate, 25 wt% fine mineral aggregate, and 25 wt% epoxy resin. Metal chips and glass fibers were introduced at 2, 4, and 8 wt% of the PC material to enhance its mechanical response. Subsequently, the specimens underwent 3-point bending tests to obtain tensile strength, mode I fracture toughness, and energy absorption up to failure. The findings revealed that adding 4% brass chips along with 4% glass fibers significantly enhanced energy absorption (by a factor of 3.8). However, using 4% glass fibers alone improved it even more (by a factor of 10.5). According to the results, glass fibers have a greater impact than brass chips. Introducing 8% glass fibers enhanced the fracture energy by 92%. However, in unfilled samples, aggregate fracture and separation hindered crack propagation, and filled samples presented added barriers, resulting in multiple-site cracking.

A Novel Technique for Substrate Toughening in Wood Single Lap Joints Using a Zero-Thickness Bio-Adhesive.

In contemporary engineering practices, the utilization of sustainable materials and eco-friendly techniques has gained significant importance. Wooden joints, particularly those created with polyurethan-based bio-adhesives, have garnered significant attention owing to their intrinsic environmental advantages and desirable mechanical properties. In comparison to conventional joining methods, adhesive joints offer distinct benefits such as an enhanced load distribution, reduced stress concentration, and improved aesthetic appeal. In this study, reference and toughened single-lap joint samples were investigated experimentally and numerically under quasi-static loading conditions. The proposed research methodology involves the infusion of a bio-adhesive into the wooden substrate, reinforcing the matrix of its surfaces. This innovative approach was developed to explore a synergetic effect of both wood and bio-adhesive. The experimentally validated results showcase a significant enhancement in joint strength, demonstrating an 85% increase when compared to joints with regular pine substrates. Moreover, the increased delamination thickness observed in toughened joints was found to increase the energy absorption of the joint.

Effects of Mode Mixity and Loading Rate on Fracture Behavior of Cracked Thin-Walled 304L Stainless Steel Sheets with Large Non-Linear Plastic Deformation.

This study investigates the mixed-mode I/II fracture behavior of O-notched diagonally loaded square plate (DLSP) samples containing an edge crack within the O-notch. This investigation aims to explore the combined effects of loading rate and mode mixity on the fracture properties of steel 304L, utilizing DLSP samples. The DLSP samples, made from strain-hardening steel 304L, were tested at three different loading rates: 1, 50, and 400 mm/min, covering five mode mixities from pure mode I to pure mode II. Additionally, tensile tests were performed on dumbbell-shaped specimens at the same loading rates to examine their influence on the material's mechanical properties. The findings revealed that stress and strain diagrams derived from the dumbbell-shaped samples were largely independent of the tested loading rates (i.e., 1-400 mm/min). Furthermore, experimental results from DLSP samples showed no significant impact of the loading rates on the maximum load values, but did indicate an increase in the ultimate displacement. In contrast to the loading rate, mode mixity exhibited a notable effect on the fracture behavior of DLSP samples. Ultimately, it was observed that the loading rate had an insignificant effect on the fracture path or trajectory of the tested DLSP samples.

Effect of the Interface/Interphase on the Water Ingress Properties of Joints with PBT-GF30 and Aluminum Substrates Using Silicone Adhesive.

The aim of this work is to analyze the difference between silicone/composite and silicone/metal interphases, both in terms of water diffusion behavior and failure of the aged joints. For that, silicone joints with two different suhbstrates were prepared. The substrates were polybutylene terephthalate with 30% of short glass fiber (PBT-GF30) and 6082-T6 aluminum. It is assumed that the water uptake of the joints is equal to the water uptake of the substrate, adhesive, and interphase. Therefore, knowing the first three, the last could be isolated. To study the water diffusion behavior of the complete joint, rectangular joints were prepared, immersed in water and their water uptake was measured. The water immersion was conducted at 70 °C. It was concluded that the aluminum/silicone joints absorbed more water through the interphase region than the PBT-GF30/silicone joints, since the difference between the expected water uptake and the experimentally measured mass gain is significantly higher, causing adhesive failure of the joint. The same was not observed in the PBT-GF30/silicone, with a more stable interphase, that does not absorb measurable quantities of water and always exhibits cohesive failure.

Impact Fatigue Life of Adhesively Bonded Composite-Steel Joints Enhanced with the Bi-Adhesive Technique.

One of the most common loading conditions that bonded joints experience in service is repeated impact. Despite the destructive effects of impact fatigue, the behavior of metal-composite bonded joints subjected to repeated impact loads has rarely been studied in the literature. Therefore, it is of utmost importance to pay attention to this phenomenon on the one hand and to find solutions to improve the impact fatigue life of bonded composite metal components on the other hand. Accordingly, in this study, the use of the bi-adhesive technique is proposed to improve the durability of composite-metal single-lap joints (SLJs) under impact fatigue loading conditions. J-N (energy-life) method is also used to analyze the experimental data obtained. Accordingly, in the present study, the impact fatigue behavior of single adhesive metal to composite joints was analyzed experimentally based on the J-N method and also numerically using the finite element method (FEM). By using two adhesives along a single overlap, the impact fatigue life of joints between dissimilar composite and metal joints was also analyzed experimentally. The results show that the double adhesives technique can significantly improve the impact fatigue life of the tested joints. It was also found that the optimum length ratio of the adhesives (the length covered by the ductile adhesive relative to the total overlap size) is a function of the stiffness of the joint and is more pronounced for less stiff bonded joints. A linear elastic numerical analysis was also conducted to evaluate the stress state along the bloodline of the bonded joints. Results show that the compressive peel stress made at the boundary of the two adhesives can be a possible reason behind the different results observed.

Enhancing Fatigue Life and Strength of Adhesively Bonded Composite Joints: A Comprehensive Review.

Adhesive bonding is widely seen as the most optimal method for joining composite materials, bringing significant benefits over mechanical joining, such as lower weight and reduced stress concentrations. Adhesively bonded composite joints find extensive applications where cyclic fatigue loading takes place, but this might ultimately lead to crack damage and safety issues. Consequently, it has become essential to study how these structures behave under fatigue loads and identify the remaining gaps in knowledge to give insights into new possibilities. The fatigue life of adhesively bonded composite joints is influenced by various parameters, including joint configuration and material properties of adherends and adhesive. Numerous studies with varying outcomes have been documented in the literature. However, due to the multitude of influential factors, deriving conclusive insights from these studies for practical design purposes has proven to be challenging. Hence, this review aims to address this challenge by discussing different methods to enhance the fatigue performance of adhesively bonded composite joints. Additionally, it provides a comprehensive overview of the existing literature on adhesively bonded composite joints under cyclic fatigue loading, focusing on three main aspects: Adherends modification, adhesive modification, and joint configurations. Since the effect of modifying the adhesive, adherends, and joint configurations on fatigue performance has not been comprehensively studied in the literature, this review aims to fill this gap by compiling and comparing the relevant experimental data. Furthermore, this review discusses the challenges and limitations associated with the methods that can be used to monitor the initiation and propagation of fatigue cracks.

Effect of Through-the-Thickness Delamination Position on the R-Curve Behavior of Plain-Woven ENF Specimens.

In this study, the effect of through-the-thickness delamination plane position on the R-curve behavior of end-notch-flexure (ENF) specimens was investigated using experimental and numerical procedures. From the experimental point of view, plain-woven E-glass/epoxy ENF specimens with two different delamination planes, i.e., [012//012] and [017//07], were manufactured by hand lay-up method. Afterward, fracture tests were conducted on the specimens by aiding ASTM standards. The main three parameters of R-curves, including the initiation and propagation of mode II interlaminar fracture toughness and the fracture process zone length, were analyzed. The experimental results revealed that changing the delamination position in ENF specimen has a negligible effect on the initiation and steady steady-state toughness values of delamination. In the numerical part, the virtual crack closure technique (VCCT) was used in order to analyze the imitation delamination toughness as well as the contribution of another mode on the obtained delamination toughness. The numerical results indicated that by choosing an appropriate value of cohesive parameters, the trilinear cohesive zone model (CZM) is capable of predicting the initiation as well as propagation of the ENF specimens. Finally, the damage mechanisms at the delaminated interface were investigated with microscopic images taken using a scanning electron microscope.

From High Strain Rates to Elevated Temperatures: Investigating Mixed-Mode Fracture Behaviour in a Polyurethane Adhesive.

The investigation of the behaviour of adhesive joints under high strain rates is an active area of research, primarily due to the widespread use of adhesives in various industries, including automotive manufacturing. Understanding how adhesives perform when subjected to high strain rates is crucial for designing vehicle structures. Additionally, it is particularly important to comprehend the behaviour of adhesive joints when exposed to elevated temperatures. Therefore, this study aims to analyse the impact of strain rate and temperature on the mixed-mode fracture characteristics of a polyurethane adhesive. To achieve this, mixed-mode bending tests were conducted on test specimens. These specimens were subjected to three different strain rates (0.2 mm/min, 200 mm/min, and 6000 mm/min) and tested at temperatures ranging from -30 °C to 60 °C. The crack size was measured using a compliance-based method during the tests. For temperatures above Tg, the maximum load supported by the specimen increased with an increasing loading rate. GI increased by a factor of 35 for an intermediate strain rate and 38 for a high strain rate from low temperature (-30 °C) to room temperature (23 °C). GII also increased for the same conditions by a factor of 25 and 95 times, respectively.

Loading Rate and Temperature Interaction Effects on the Mode I Fracture Response of a Ductile Polyurethane Adhesive Used in the Automotive Industry.

Due to their high elongation at failure and damping capacity, polyurethanes are one of the main types of adhesives used in automotive structures. However, despite the wide range of applications of adhesives, their fracture mechanics behavior is still poorly studied in the literature, especially when both the loading rate and ambient temperature change. Accordingly, the main aim of the current work is to deal with the research gap. In the current research, mode I fracture energy of a ductile polyurethane adhesive with adaptive properties for its industrial application is determined at different test speeds and temperatures. Tests were done at quasi-static, intermediate, and high-speed levels and each at three different temperatures, including low, high, and room temperature. Mode I fracture toughness was determined using DCB tests. Increasing the loading rate from quasi-static to 6000 mm/min was found to significantly increase the maximum strength of the tested DCBs (from 1770 N to about 4180 N). The greatest sensitivity to the loading rate was observed for the DCBs tested at room temperature, where the fracture energy increased by a factor of 3.5 from quasi-static (0.2 mm/min) to a high loading rate (6000 mm/min). The stiffness analysis of the DCB samples showed that the transition from below the Tg to room temperature decreases the bond stiffness by about 60%, while a further temperature increase (from 23 °C to 60 °C) has no significant effect on this parameter. Since polyurethane-bonded joints often experience a wide range of temperatures and loading rates in service, the obtained results can be used to design these joints more securely against such loading/environmental conditions.

Effect of Water Ingress on the Mechanical and Chemical Properties of Polybutylene Terephthalate Reinforced with Glass Fibers.

Short fiber reinforced polymers are widely used in the construction of electronic housings, where they are often exposed to harsh environmental conditions. The main purpose of this work is the in-depth study and characterization of the water uptake behavior of PBT-GF30 (polybutylene terephthalate with 30% of short glass fiber)as well as its consequent effect on the mechanical properties of the material. Further analysis was conducted to determine at which temperature range PBT-GF30 starts experiencing chemical changes. The influence of testing procedures and conditions on the evaluation of these effects was analyzed, also drawing comparisons with previous studies. The water absorption behavior was studied through gravimetric tests at 35, 70, and 130 °C. Fiber-free PBT was also studied at 35 °C for comparison purposes. The effect of water and temperature on the mechanical properties was analyzed through bulk tensile tests. The material was tested for the three temperatures in the as-supplied state (without drying or aging). Afterwards, PBT-GF30 was tested at room temperature following water immersion at the three temperatures. Chemical changes in the material were also analyzed through Fourier-transform infrared spectroscopy (FTIR). It was concluded that the water diffusion behavior is Fickian and that PBT absorbs more water than PBT-GF30 but at a slightly higher rate. However, temperature was found to have a more significant influence on the rate of water diffusion of PBT-GF30 than fiber content did. Temperature has a significant influence on the mechanical properties of the material. Humidity contributes to a slight drop in stiffness and strength, not showing a clear dependence on water uptake. This decrease in mechanical properties occurs due to the relaxation of the polymeric chain promoted by water ingress. Between 80 and 85 °C, after water immersion, the FTIR profile of the material changes, which suggests chemical changes in the PBT. The water absorption was simulated through heat transfer analogy with good results. From the developed numerical simulation, the minimum plate size to maintain the water ingress unidirectional was 30 mm, which was validated experimentally.