Effects of thermal annealing on analog resistive switching behavior in bilayer HfO2/ZnO synaptic devices: the role of ZnO grain boundaries.

The effects of thermal annealing on analog resistive switching behavior in bilayer HfO2/ZnO synaptic devices were investigated. The annealed active ZnO layer between the top Pd electrode and the HfO2 layer exhibited electroforming-free resistive switching. In particular, the switching uniformity, stability, and reliability of the synaptic devices were dramatically improved via thermal annealing at 600 °C atomic force microscopy and X-ray diffraction analyses revealed that active ZnO films demonstrated increased grain size upon annealing from 400 °C to 700 °C, whereas the ZnO film thickness and the annealing of the HfO2 layer in bilayer HfO2/ZnO synaptic devices did not profoundly affect the analog switching behavior. The optimized thermal annealing at 600 °C in bilayer HfO2/ZnO synaptic devices dramatically improved the nonlinearity of long-term potentiation/depression properties, the relative coefficient of variation of the asymmetry distribution σ/µ, and the asymmetry ratio, which approached 1. The results offer valuable insights into the implementation of highly robust synaptic devices in neural networks.

Bottom-Gated ZnO TFT Pressure Sensor with 1D Nanorods.

In this study, a bottom-gated ZnO thin film transistor (TFT) pressure sensor with nanorods (NRs) is suggested. The NRs are formed on a planar channel of the TFT by hydrothermal synthesis for the mediators of pressure amplification. The fabricated devices show enhanced sensitivity by 16~20 times better than that of the thin film structure because NRs have a small pressure transmission area and causes more strain in the underlayered piezoelectric channel material. When making a sensor with a three-terminal structure, the leakage current in stand-by mode and optimal conductance state for pressure sensor is expected to be controlled by the gate voltage. A scanning electron microscope (SEM) was used to identify the nanorods grown by hydrothermal synthesis. X-ray diffraction (XRD) was used to compare ZnO crystallinity according to device structure and process conditions. To investigate the effect of NRs, channel mobility is also extracted experimentally and the lateral flow of current density is analyzed with simulation (COMSOL) showing that when the piezopotential due to polarization is formed vertically in the channel, the effective mobility is degraded.

High Pressure Deuterium Passivation of Charge Trapping Layer for Nonvolatile Memory Applications.

In this study, the deuterium passivation effect of silicon nitride (Si3N4) on data retention characteristics is investigated in a Metal-Nitride-Oxide-Silicon (MNOS) memory device. To focus on trap passivation in Si3N4 as a charge trapping layer, deuterium (D2) high pressure annealing (HPA) was applied after Si3N4 deposition. Flat band voltage shifts (ΔVFB) in data retention mode were compared by CV measurement after D2 HPA, which shows that the memory window decreases but charge loss in retention mode after program is suppressed. Trap energy distribution based on thermal activated retention model is extracted to compare the trap density of Si3N4. D2 HPA reduces the amount of trap densities in the band gap range of 1.06-1.18 eV. SIMS profiles are used to analyze the D2 profile in Si3N4. The results show that deuterium diffuses into the Si3N4 and exists up to the Si3N4-SiO2 interface region during post-annealing process, which seems to lower the trap density and improve the memory reliability.

Physical and Electrical Analysis of Poly-Si Channel Effect on SONOS Flash Memory.

In this study, polycrystalline silicon (poly-Si) is applied to silicon-oxide-nitride-oxide-silicon (SONOS) flash memory as a channel material and the physical and electrical characteristics are analyzed. The results show that the surface roughness of silicon nitride as charge trapping layer (CTL) is enlarged with the number of interface traps and the data retention properties are deteriorated in the device with underlying poly-Si channel which can be serious problem in gate-last 3D NAND flash memory architecture. To improve the memory performance, high pressure deuterium (D2) annealing is suggested as a low-temperature process and the program window and threshold voltage shift in data retention mode is compared before and after the D2 annealing. The suggested curing is found to be effective in improving the device reliability.

CO2 absorption and desorption in an aqueous solution of heavily hindered alkanolamine: structural elucidation of CO2-containing species.

The pathways for the CO2 absorption and desorption in an aqueous solution of a heavily hindered alkanolamine, 2-(t-butylamino)ethanol (TBAE) were elucidated by X-ray crystallographic and (13)C NMR spectroscopic analysis. In the early stage of the CO2 absorption, the formation of carbonate species ([TBAEH]2CO3) was predominant, along with the generation of small amounts of zwitterionic species. With the progress of the absorption, the carbonate species was rapidly transformed into bicarbonate species ([TBAEH]HCO3), and the amounts of the zwitterionic species increased gradually. During desorption at elevated temperature in the absence of CO2, [TBAEH]HCO3 was found to transform into [TBAEH]2CO3, where CO3(2-) strongly interacts with two [TBAEH](+) via hydrogen bondings.